- Patent Title: Reducing or eliminating pre-amorphization in transistor manufacture
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Application No.: US15298933Application Date: 2016-10-20
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Publication No.: US09793172B2Publication Date: 2017-10-17
- Inventor: Lance Scudder , Pushkar Ranade , Charles Stager , Urupattur C. Sridharan , Dalong Zhao
- Applicant: Mie Fujitsu Semiconductor Limited
- Applicant Address: JP Kuwana
- Assignee: Mie Fujitsu Semiconductor Limited
- Current Assignee: Mie Fujitsu Semiconductor Limited
- Current Assignee Address: JP Kuwana
- Agency: Baker Botts L.L.P.
- Main IPC: H01L21/425
- IPC: H01L21/425 ; H01L21/8238 ; H01L21/265 ; H01L29/66 ; H01L29/10 ; H01L21/04 ; H01L21/82 ; H01L21/02 ; H01L27/092 ; H01L29/78

Abstract:
A method for fabricating field effect transistors using carbon doped silicon layers to substantially reduce the diffusion of a doped screen layer formed below a substantially undoped channel layer includes forming an in-situ epitaxial carbon doped silicon substrate that is doped to form the screen layer in the carbon doped silicon substrate and forming the substantially undoped silicon layer above the carbon doped silicon substrate. The method may include implanting carbon below the screen layer and forming a thin layer of in-situ epitaxial carbon doped silicon above the screen layer. The screen layer may be formed either in a silicon substrate layer or the carbon doped silicon substrate.
Public/Granted literature
- US20170040225A1 Reducing or Eliminating Pre-Amorphization in Transistor Manufacture Public/Granted day:2017-02-09
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