Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US14313363Application Date: 2014-06-24
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Publication No.: US09793180B2Publication Date: 2017-10-17
- Inventor: Seo Yeon Ahn , Doo Hyun Park , Pil Je Sung , Won Chul Do , Young Rae Kim , Seung Chul Han , Joo Hyun Kim , Jong Sik Paek
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2014-0007894 20140122
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L21/66 ; H01L21/78 ; H01L23/00 ; H01L23/31 ; H01L21/56 ; H01L23/498
Abstract:
A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise connection verification for a first one or more mounted components prior to additional assembly.
Public/Granted literature
- US20150206807A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-07-23
Information query
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