Invention Grant
- Patent Title: Semiconductor wafer and method of backside probe testing through opening in film frame
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Application No.: US15230875Application Date: 2016-08-08
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Publication No.: US09793186B1Publication Date: 2017-10-17
- Inventor: Michael J. Seddon , Heng Chen Lee
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Patent Law Group: Atkins and Associates, P.C.
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L29/10 ; H01L21/66 ; H01L21/78
Abstract:
A semiconductor test system has a film frame including a tape portion with one or more openings through the tape portion. The opening is disposed in a center region of the tape portion of the film frame. The film frame may have conductive traces formed on or through the tape portion. A thin semiconductor wafer includes a conductive layer formed over a surface of the semiconductor wafer. The semiconductor wafer is mounted over the opening in the tape portion of the film frame. A wafer probe chuck includes a lower surface and raised surface. The film frame is mounted to the wafer probe chuck with the raised surface extending through the opening in the tape portion to contact the conductive layer of the semiconductor wafer. The semiconductor wafer is probe tested through the opening in the tape portion of the film frame.
Information query
IPC分类:
