Invention Grant
- Patent Title: Semiconductor package and manufacturing method thereof
-
Application No.: US14955010Application Date: 2015-11-30
-
Publication No.: US09793251B2Publication Date: 2017-10-17
- Inventor: Jun-Kyu Lee , Yong-Tae Kwon
- Applicant: NEPES CO., LTD.
- Applicant Address: KR Chungcheongbuk-Do
- Assignee: NEPES CO., LTD.
- Current Assignee: NEPES CO., LTD.
- Current Assignee Address: KR Chungcheongbuk-Do
- Agency: Ladas & Parry, LLP
- Priority: KR10-2014-0194450 20141230
- Main IPC: H01L21/52
- IPC: H01L21/52 ; H01L23/31 ; H01L23/498 ; H01L25/16 ; H01L23/00 ; H01L23/13 ; H01L21/56
Abstract:
Disclosed herein is a semiconductor package in which a semiconductor chip and a mounting device are packaged together. The semiconductor package includes a semiconductor chip, a mounting block on which a first mounting device is mounted on a substrate that includes a circuit formed thereon, and an interconnection part configured to electrically connect the semiconductor chip to the mounting block.
Public/Granted literature
- US20160190108A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-06-30
Information query
IPC分类:
