Invention Grant
- Patent Title: Power semiconductor device
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Application No.: US15061017Application Date: 2016-03-04
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Publication No.: US09793261B2Publication Date: 2017-10-17
- Inventor: Masaaki Takiguchi , Katsuhisa Kawasaki
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agent David M. Tennant
- Priority: JP2015-177695 20150909
- Main IPC: H01L33/24
- IPC: H01L33/24 ; H01L27/06 ; H01L27/092 ; H01L29/872

Abstract:
A power semiconductor device includes: a first MOSFET having a first conductivity type including a first source, a first drain, and a first gate; a second MOSFET having a first conductivity type including a second drain, a second source electrically coupled to the first source, and a second gate electrically coupled the first gate; and a diode being coupled between the first and second drains. A breakdown voltage of the first MOSFET is higher than that of the second MOSFET
Public/Granted literature
- US20170069622A1 POWER SEMICONDUCTOR DEVICE Public/Granted day:2017-03-09
Information query
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