A method for producing an array substrate is provided. The method includes: forming metal film layers and patterning the metal film layers to form a plurality rows of gate lines and a plurality columns of data lines crossed to each other in the non-display area and forming thin film transistors; forming a pad part at one end of the gate lines or data lines. The process of producing the pad part includes: forming a first insulation layer on the metal film layers by patterning; forming an etching protection layer, a source and drain metal layer and a second insulation layer sequentially by patterning, wherein the first insulation layer, the etching protection layer, the source and drain metal layer and the second insulation layer form a trapezoid stack.