Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
-
Application No.: US15070218Application Date: 2016-03-15
-
Publication No.: US09793357B2Publication Date: 2017-10-17
- Inventor: Hiroshi Kono , Kohei Morizuka , Yoichi Hori , Atsuko Yamashita , Tomohiro Nitta
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: White & Case LLP
- Priority: JP2015-181273 20150914
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/16 ; H01L29/45 ; H01L29/06 ; H01L29/40 ; H01L29/78 ; H01L29/739 ; H01L21/04 ; H01L29/66 ; H01L29/10 ; H01L29/08

Abstract:
A semiconductor device includes first, second, third, and fourth electrodes, a first insulating film, and first, second third, and fourth silicon carbide layers. A first distance between the first electrode and a first interface between the fourth electrode and fourth silicon carbide region is longer than a second distance between the first insulating film and a second interface between the third silicon carbide region and the fourth silicon carbide region. The fourth silicon carbide region is between the third silicon carbide region and the second silicon carbide region in a direction perendicular to the second interface.
Public/Granted literature
- US20170077238A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-03-16
Information query
IPC分类: