Provided is an OLED device packaging method, which includes: providing an OLED substrate that includes an OLED unit formed on surface thereof; attaching an insulation material to the surface of the OLED substrate to form a first frame having frame members located outside and circumferentially surround arranged the OLED unit; providing a packaging cover having a surface; attaching a low-temperature metal conductive adhesive tape directly on the surface of the packaging cover to form a second frame having frame members corresponding to and having a width smaller than the frame members of the first frame; laminating the packaging cover and the OLED substrate together in a vacuum environment with the frame members of first and second frames stacked on each other; and (6) melting the second frame securely bond the packaging cover and the OLED substrate together. Also provided is an OLED device formed with such a packaging method.