Disclosed is an apparatus for peeling a coil of a motor, including a pallet on which the coil is mounted; a conveying part formed long in a lengthwise direction and configured to convey the pallet; a clamper located at the side surface of the conveying part and formed to be movable toward the conveying part and to fix the tip portion of the coil; and a laser irradiating part located at a side surface of the conveying part to radiate laser at a peeling work spot and to peel a coating layer of a tip portion of the coil. Therefore, a bonding force between the coil and the bus bar can be easily increased.