Invention Grant
- Patent Title: Printed wiring board
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Application No.: US14717280Application Date: 2015-05-20
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Publication No.: US09795027B2Publication Date: 2017-10-17
- Inventor: Hirohito Watanabe , Taiji Ogawa
- Applicant: FUJIKURA LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJIKURA LTD.
- Current Assignee: FUJIKURA LTD.
- Current Assignee Address: JP Tokyo
- Agency: Osha Liang LLP
- Priority: JP2014-105106 20140521
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01P3/08 ; H01P1/02 ; H05K1/03

Abstract:
To suppress occurrence of a difference in transmission time due to a difference in length between signal lines, there is provided a printed wiring board having: an insulating substrate (10); a first signal line (L31) formed on the insulating substrate (10); a second signal line (L32) having a shorter length than that of the first signal line (L31); and a ground layer (30) formed for the first signal line (L31) and the second signal line (L31) via an insulating material (10). The ground layer (30) includes a first ground layer (G31) corresponding to a first region (D1) and a second ground layer (G32) corresponding to a second region (D2). The first region (D1) is defined based on the first signal line (L31) and has a first predetermined width (W31). The second region (D2) is defined based on the second signal line (L32) and has a second predetermined width (W32). The first ground layer (G31) has a remaining ratio lower than a remaining ratio of the second ground layer (G32).
Public/Granted literature
- US20150340751A1 PRINTED WIRING BOARD Public/Granted day:2015-11-26
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