Invention Grant
- Patent Title: Multilayer structure and related method of manufacture for electronics
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Application No.: US15343731Application Date: 2016-11-04
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Publication No.: US09801273B2Publication Date: 2017-10-24
- Inventor: Antti Keranen , Jarmo Saaski , Mikko Heikkinen
- Applicant: Tacto Tek Oy
- Applicant Address: FI Kempele
- Assignee: TactoTek Oy
- Current Assignee: TactoTek Oy
- Current Assignee Address: FI Kempele
- Agency: Carter, DeLuca, Farrell & Schmidt, LLP
- Agent Robert P. Michal, Esq.
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/11 ; H05K1/16 ; H05K1/18 ; H05K3/00 ; H05K3/28

Abstract:
A multilayer structure (200) including a preferably flexible substrate film (102) capable of accommodating electronics (106, 108), such as conductive traces and optionally electronic components such as SMDs (surface-mount device), on a first side thereof, the film having the first side and a second side, and a plastic layer (204) molded onto the first side of the substrate and protruding at one or more locations (114, 114B) through the substrate onto the second side, forming one or more protrusions (218) on the second side having a predetermined function. A corresponding method of manufacture is presented.
Public/Granted literature
- US20170135198A1 MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE FOR ELECTRONICS Public/Granted day:2017-05-11
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