Invention Grant
- Patent Title: Electrical modules and modular electronic building systems
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Application No.: US14721341Application Date: 2015-05-26
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Publication No.: US09801300B2Publication Date: 2017-10-24
- Inventor: Zhenshan Wang , Kejia Pan , Bin Feng
- Applicant: Microduino Inc. , Meike Technology (Beijing) Ltd.
- Applicant Address: US CA Westlake Village CN Beijing
- Assignee: MICRODUINO INC.,MEIKE TECHNOLOGY (BEIJING) LTD.
- Current Assignee: MICRODUINO INC.,MEIKE TECHNOLOGY (BEIJING) LTD.
- Current Assignee Address: US CA Westlake Village CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201510085854 20150220
- Main IPC: H05K7/14
- IPC: H05K7/14

Abstract:
The present disclosure provides an electrical module and a modular electrical building system including electrical modules. The electrical module includes a printed circuit board (PCB), a housing member, one or more magnets, and one or more inter-locking parts. The PCB has a top surface, a bottom surface, and opposite sides between the top surface and the bottom surface. The housing member is attached to each side of two opposite sides of the PCB and includes an opening in a bottom surface. The magnets are arranged within the housing member and are capably of magnetically attaching the electrical module to another electrical module. Each inter-locking part is configured to pass through the housing member on each side of the PCB. Each inter-locking part has a protrusion extending from a top surface of the housing member and is exposed to the opening in the bottom surface of the housing member.
Public/Granted literature
- US20160249478A1 ELECTRICAL MODULES AND MODULAR ELECTRONIC BUILDING SYSTEMS Public/Granted day:2016-08-25
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