Invention Grant
- Patent Title: Electromagnetic relay
-
Application No.: US14779826Application Date: 2013-07-31
-
Publication No.: US09805893B2Publication Date: 2017-10-31
- Inventor: Seiki Shimoda
- Applicant: OMRON Corporation
- Applicant Address: JP Kyoto
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP Kyoto
- Agency: Osha Liang LLP
- Priority: JP2013-089831 20130422
- International Application: PCT/JP2013/070803 WO 20130731
- International Announcement: WO2014/174694 WO 20141030
- Main IPC: H01H50/16
- IPC: H01H50/16 ; H01H50/36 ; H01H50/28 ; H01H50/64 ; C23C10/54 ; C23C10/56

Abstract:
An electromagnetic relay (100) has high wear resistance, high corrosion resistance, and good magnetic properties. The electromagnetic relay (100) includes a magnetic component including an alloy layer on its surface formed by diffusion-coating of at least one element selected from the group consisting of Cr, V, Ti, and Al. The alloy layer has a thickness of 5 to 60 μm, inclusive.
Public/Granted literature
- US20160086754A1 ELECTROMAGNETIC RELAY Public/Granted day:2016-03-24
Information query