Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US14845554Application Date: 2015-09-04
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Publication No.: US09805938B2Publication Date: 2017-10-31
- Inventor: Naozumi Fujiwara , Toru Edo , Yuji Sugahara , Seiji Ano , Jun Sawashima
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JP2014-190100 20140918
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L21/67 ; H01L21/02 ; B08B3/02 ; B08B3/04 ; B08B1/04

Abstract:
A substrate processing apparatus includes a rotating holder for a substrate, a first nozzle used to eject a jet flow, a second nozzle used to discharge a continuous flow, and a nozzle moving unit integrally moving the first and second nozzles. A landing position of the continuous flow is located closer to a rotation center than a landing position of the jet flow is. At least movement paths of the landing positions of the jet flow and the continuous flow or flow directions of the continuous flow and the jet flow are different from each other. The movement paths are made to be different from each other by locating the landing position of the continuous flow downstream of the movement path of the landing position of the jet flow. The flow directions are made to be different from each other by tilting the continuous flow.
Public/Granted literature
- US20160086810A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2016-03-24
Information query
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