Invention Grant
- Patent Title: Integrated circuit with power saving feature
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Application No.: US14860901Application Date: 2015-09-22
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Publication No.: US09806019B2Publication Date: 2017-10-31
- Inventor: Anis M. Jarrar , David R. Tipple , Jeff L. Warner
- Applicant: FREESCALE SEMICONDUCTOR, INC.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L27/092 ; H01L21/8238 ; H01L27/06 ; H01L23/485 ; G06F17/50 ; H01L23/528 ; H01L27/02

Abstract:
An integrated circuit includes a first transistor including a first current electrode, a second current electrode, and a bulk tie; a first conductive line coupled between the first current electrode and a first supply voltage; and a second conductive line coupled to the second current electrode. A resistance of the second conductive line is at least 5 percent greater than a resistance of the first conductive line. The bulk tie is coupled to a second supply voltage. The first supply voltage is different than the second supply voltage.
Public/Granted literature
- US20170084535A1 INTEGRATED CIRCUIT WITH POWER SAVING FEATURE Public/Granted day:2017-03-23
Information query
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