In a method of forming an assembly including projecting or protruding nodules, a substrate is provided that supports an electrical circuit. One or more cavities are formed in the substrate, a conductive pad is formed in each cavity, and one or more conductive traces are formed on the substrate. Each conductive trace connects a conductive pad to a location, node, or terminal of the electrical circuit. A part of the substrate is removed to form the assembly that includes the electrical circuit, the one or more conductive traces, and a portion of each conductive pad projecting or protruding from the substrate. The electrical circuit can be formed on the substrate, which can be a PCB, or can be formed on a microchip supported by the substrate, which can be formed of semiconductor material, e.g., a semiconductor wafer.