A resin-attached lead frame and a semiconductor device including the resin-attached lead frame. The resin-attached lead frame includes a lead frame main body having a die pad (LED element resting portion) and a lead portion disposed apart from the die pad. The lead frame main body further includes an LED element resting region formed over an area including an upper surface of the die pad and an upper surface of the lead portion. A reflecting resin section surrounds the LED element resting region of the lead frame main body. A vapor-deposited aluminum layer or a sputtered aluminum layer is provided on an upper surface of the LED element resting region of the lead frame main body.