Invention Grant
- Patent Title: Interposers having three housings interconnected to each other
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Application No.: US15168036Application Date: 2016-05-28
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Publication No.: US09806446B2Publication Date: 2017-10-31
- Inventor: Jae Hwang Lee , Mahmoud R. Amini , Zheng Gao , Nathan N. Ng
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/71 ; H01R24/66 ; H01R31/06 ; H01R12/52 ; H01R12/72 ; H01R13/04 ; H01R13/658

Abstract:
Connecting structures to mechanically connect to a connector receptacle tongue and a printed circuit board and to electrically connect contacts on the connector receptacle tongue to traces on the printed circuit board. One example may provide an interposer having a housing and a plurality of contacts to connect a vertical tongue to a horizontal printed circuit board. The contacts may have a side or tongue connecting portion extending beyond a side of the housing and a bottom or board contacting portion extending beyond a bottom of the housing. The contacts may form a ninety-degree bend. A shield may at least substantially surround a vertical side of the housing.
Public/Granted literature
- US20160276765A1 INTERPOSERS FOR CONNECTING RECEPTACLE TONGUES TO PRINTED CIRCUIT BOARDS Public/Granted day:2016-09-22
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