Invention Grant
- Patent Title: Conducting package structure and manufacturing method thereof
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Application No.: US14588321Application Date: 2014-12-31
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Publication No.: US09807888B2Publication Date: 2017-10-31
- Inventor: Yu-Tung Huang , Ming-Hung Chang
- Applicant: TAI-SAW TECHNOLOGY CO., LTD.
- Applicant Address: TW Taoyuan
- Assignee: TAI-SAW TECHNOLOGY CO., LTD.
- Current Assignee: TAI-SAW TECHNOLOGY CO., LTD.
- Current Assignee Address: TW Taoyuan
- Agency: The PL Law Group, PLLC
- Priority: TW102149389A 20131231
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H05K3/30 ; H01L23/498 ; H05K1/11 ; H01L23/00
Abstract:
A conducting package structure includes a substrate and a conducting material. The conducting material is formed to a first patterned structure. The first patterned structure has a first surface which is connected to the substrate and a patterned second surface opposite to the first surface.
Public/Granted literature
- US20150189802A1 CONDUCTING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-07-02
Information query
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