Invention Grant
- Patent Title: Rivet module and joining structure and method using the same
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Application No.: US14524039Application Date: 2014-10-27
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Publication No.: US09808855B2Publication Date: 2017-11-07
- Inventor: Yun Sung Chung , Mun Yong Lee
- Applicant: SUNGWOO HITECH CO., LTD.
- Applicant Address: KR Busan
- Assignee: SUNGWOO HITECH CO., LTD.
- Current Assignee: SUNGWOO HITECH CO., LTD.
- Current Assignee Address: KR Busan
- Agency: Lex IP Meister, PLLC
- Priority: KR10-2014-0124566 20140918
- Main IPC: F16B35/06
- IPC: F16B35/06 ; B21J15/02 ; F16B19/08 ; F16B19/10 ; B21J15/04 ; B21J15/14

Abstract:
A rivet module is provided to join at least two sheets of base materials in a solid state, the rivet module including: i) a shank portion to be mounted on a reciprocal and rotatable joining tool; ii) a base material friction portion that is integrally connected to the shank portion and drills through the base materials as the joining tool causes the base material friction portion to be rotated while applying pressure to the base materials; and iii) a base material fastening portion that is fixedly fitted to the shank portion, supports the base material friction portion, and is fastened to the base materials through a thread formed on the outer peripheral surface thereof.
Public/Granted literature
- US20160084290A1 RIVET MODULE AND JOINING STRUCTURE AND METHOD USING THE SAME Public/Granted day:2016-03-24
Information query
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