Invention Grant
- Patent Title: Coil assembly
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Application No.: US15185804Application Date: 2016-06-17
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Publication No.: US09812256B2Publication Date: 2017-11-07
- Inventor: Tae Seok Yang , Ki Won Chang , Jae Sun Won , Hee Seung Kim , Myung Hyun Sung , Soon Joung Yio
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0181841 20151218
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F38/14 ; H02J50/10

Abstract:
A coil assembly includes a coil part including stamped coils, and a connection substrate having one end thereof disposed inside the coil part and the other end disposed outside the coil part, wherein one end of each of the stamped coils is connected to a first surface of the connection substrate and the other end connected to a second surface of the connection substrate.
Public/Granted literature
- US20170178802A1 COIL ASSEMBLY Public/Granted day:2017-06-22
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