A thermal fuse having a bow, which has a first end with a first soldering surface for soldering to a first contact surface of a printed circuit board and a second end with a second soldering surface for soldering to a second contact surface of the printed circuit board, a tensioning element, which is secured to the bow between the first and the second end and which is designed to press with a preload against the bow and the printed circuit board once the two soldering surfaces and the contact surfaces of a printed circuit board have been soldered, wherein a portion of the bow, between the two ends thereof, has a measuring resistor connected in series to the two soldering surfaces. A printed circuit board having such a thermal fuse is additionally described.