Invention Grant
- Patent Title: Method of manufacturing ultrasound probe
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Application No.: US14607884Application Date: 2015-01-28
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Publication No.: US09812635B2Publication Date: 2017-11-07
- Inventor: Gil-ju Jin , Jung-lim Park
- Applicant: SAMSUNG MEDISON CO., LTD.
- Applicant Address: KR Hongcheon-Gun, Gangwon-Do
- Assignee: SAMSUNG MEDISON CO., LTD.
- Current Assignee: SAMSUNG MEDISON CO., LTD.
- Current Assignee Address: KR Hongcheon-Gun, Gangwon-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0025678 20140304
- Main IPC: H01L41/31
- IPC: H01L41/31 ; H01L41/22 ; A61B8/14 ; H01L41/25 ; H01L41/311 ; H01L41/29 ; B06B1/06 ; A61B8/00 ; H01L41/27

Abstract:
Provided is a method of manufacturing an ultrasound probe. The method includes: preparing a backing layer having first and second surfaces with different heights due to forming a groove in the backing layer, wherein first and second electrodes are exposed on the first and second surfaces, respectively; forming a third electrode that is in contact with the first electrode; forming a base piezoelectric unit on the third electrode, the base piezoelectric unit including a piezoelectric layer; forming a piezoelectric unit by removing an upper region of the base piezoelectric unit; and forming a fourth electrode on the backing layer and the piezoelectric unit.
Public/Granted literature
- US20150250452A1 ULTRASOUND PROBE AND METHOD OF MANUFACTURING ULTRASOUND PROBE Public/Granted day:2015-09-10
Information query
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