Invention Grant
- Patent Title: Heat spreader with thermally coductive foam core
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Application No.: US14878894Application Date: 2015-10-08
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Publication No.: US09813082B2Publication Date: 2017-11-07
- Inventor: Mo Bai , Vadim Gektin
- Applicant: Futurewei Technologies, Inc.
- Applicant Address: US TX Plano
- Assignee: FUTUREWEI TECHNOLOGIES, INC.
- Current Assignee: FUTUREWEI TECHNOLOGIES, INC.
- Current Assignee Address: US TX Plano
- Agency: Slater Matsil, LLP
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20 ; H04B1/036 ; F28F13/00 ; H01L23/34 ; H01L23/367
Abstract:
A heat spreader and a method for making a heat spreader are disclosed. In an embodiment the heat spreader includes an enclosure with a hollow core and a foam core located in the hollow core.
Public/Granted literature
- US20170104500A1 Heat Spreader with Thermally Coductive Foam Core Public/Granted day:2017-04-13
Information query
