Invention Grant
- Patent Title: Broadcast signal receiving apparatus and multi-layer printed circuit board
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Application No.: US15179157Application Date: 2016-06-10
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Publication No.: US09813093B2Publication Date: 2017-11-07
- Inventor: Hyun-Jun Kim , Sung-soo Lee , Hwan-sun Hong , Ja-hun Lee , Cheol-hee Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2015-0082024 20150610
- Main IPC: H04B1/10
- IPC: H04B1/10 ; H04B1/16

Abstract:
A broadcast signal receiving apparatus, including a multi-layer printed circuit board comprising a transmission line configured to connect with at least one component mounted on the multi-layer printed circuit board, the at least one component being configured to process a broadcast signal received from an outside of the apparatus through a cable, wherein a signal line for receiving the broadcast signal is at least partially provided on an inner layer of the multi-layer printed circuit board.
Public/Granted literature
- US20160365882A1 BROADCAST SIGNAL RECEIVING APPARATUS AND MULTI-LAYER PRINTED CIRCUIT BOARD Public/Granted day:2016-12-15
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