A modular headset with a microphone boom module selectively engageable with a headband module. The microphone boom module has a speaker housing, a microphone boom, a microphone retained by the microphone boom, and a speaker retained by the speaker housing. An annular hub projects from the speaker housing, and an aperture is disposed in the headband module for receiving the hub in a pivotable engagement. Positive and negative electrical contact surfaces, such as conductive rings, are disposed over the hub, and electrical contacts project from the aperture to travel along the electrical contact surfaces. The microphone boom module has an active angular zone Za wherein the microphone boom module is active and a mute angular zone Zm. The mute angular zone Zm can include a range of angles encompassing alignment of a longitudinal orientation of the microphone boom module with a plane of the headband.