Invention Grant
- Patent Title: Fingerprint identification module
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Application No.: US15151471Application Date: 2016-05-10
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Publication No.: US09818017B2Publication Date: 2017-11-14
- Inventor: Jen-Chieh Wu
- Applicant: Gingy Technology Inc.
- Applicant Address: TW Hsinchu
- Assignee: Gingy Technology Inc.
- Current Assignee: Gingy Technology Inc.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW104140901A 20151207
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A fingerprint identification module includes a cover plate, a fingerprint identification sensor, at least one light source, and a plurality of fibers. The cover plate has an inner surface and an outer surface opposite to the inner surface. The fingerprint identification sensor and the at least one light source are located under the inner surface, and the at least one light source is located adjacent to the fingerprint identification sensor. The fibers are arranged in an array and are located between the cover plate and the fingerprint identification sensor, wherein each of the fibers has a light incident surface. The light incident surface faces the inner surface and is inclined relative to the inner surface.
Public/Granted literature
- US20170011248A1 FINGERPRINT IDENTIFICATION MODULE Public/Granted day:2017-01-12
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