Invention Grant
- Patent Title: Electronic device with a plurality of redistribution structures having different respective sizes
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Application No.: US15066724Application Date: 2016-03-10
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Publication No.: US09818684B2Publication Date: 2017-11-14
- Inventor: David Hiner , Michael Kelly , Ronald Huemoeller , Young Rae Kim , JiYoung Chung , MinHo Chang , DoHyun Na
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L21/00 ; H01L23/498 ; H01L23/31 ; H01L21/56
Abstract:
A semiconductor device with enhanced interposer quality, and method of manufacturing thereof. For example and without limitation, various aspects of the present disclosure provide an interposer die that comprises a first signal distribution structure comprising at least a first dielectric layer and a first conductive layer, wherein the signal distribution structure is protected at lateral edges by a protective layer. Also for example, various aspects of the present disclosure provide a method of manufacturing a semiconductor device comprising such an interposer die.
Public/Granted literature
- US20170263544A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-09-14
Information query
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