Invention Grant
- Patent Title: Memory metal scheme
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Application No.: US15153872Application Date: 2016-05-13
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Publication No.: US09818752B2Publication Date: 2017-11-14
- Inventor: Derek C. Tao , Jacklyn Chang , Kuoyuan (Peter) Hsu , Yukit Tang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: G11C5/02
- IPC: G11C5/02 ; G11C5/06 ; H01L27/11 ; H01L23/50 ; G11C11/418 ; G11C11/419 ; H01L23/522 ; H01L23/528 ; H01L27/02 ; H01L27/06

Abstract:
A method of fabricating a memory includes forming a first portion of a first line in a first metal layer, forming a first portion of a second line in the first metal layer, forming a second portion of the first line in a second metal layer, and forming a second portion of the second line in a third metal layer. The first line is over a plurality of memory cells. The second line is over the plurality of memory cells, the first line is electrically isolated from the second line, and the first line and the second line extend in a same direction. The second metal layer is over the first metal layer. The third metal layer is over the second metal layer and the third metal layer is electrically isolated from the first line.
Public/Granted literature
- US20160254267A1 MEMORY METAL SCHEME Public/Granted day:2016-09-01
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