Invention Grant
- Patent Title: Coil electronic component and method of manufacturing the same
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Application No.: US14992904Application Date: 2016-01-11
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Publication No.: US09824824B2Publication Date: 2017-11-21
- Inventor: Heung Kil Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2015-0055397 20150420
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H01G4/30 ; H01G4/248 ; H01G4/12 ; H01G4/012 ; H01G4/38 ; H01G2/06 ; H01G4/232 ; H01L41/053 ; H05K1/03 ; H05K1/14 ; H01L41/083

Abstract:
A capacitor component includes a capacitor including a plurality of internal electrodes, a capacitor body containing a piezoelectric material disposed in at least regions between the plurality of internal electrodes, and external electrodes connected to the plurality of internal electrodes; and an interposer disposed to be coupled to the capacitor and including a buffer substrate containing a buffer material having a degree of piezoelectricity lower than that of the piezoelectric material, and connection electrodes electrically connected to the external electrodes.
Public/Granted literature
- US20160309578A1 COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-10-20
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