Invention Grant
- Patent Title: Bonded structure and production method therefor
-
Application No.: US14440124Application Date: 2012-11-09
-
Publication No.: US09824900B2Publication Date: 2017-11-21
- Inventor: Motomune Kodama , Takashi Naito , Yuichi Sawai , Tadashi Fujieda , Takuya Aoyagi , Masanori Miyagi
- Applicant: Hitachi, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- International Application: PCT/JP2012/079060 WO 20121109
- International Announcement: WO2014/073086 WO 20140515
- Main IPC: C03C3/21
- IPC: C03C3/21 ; C03C3/12 ; C03C8/08 ; C03C8/02 ; C03C8/24 ; C03C8/14 ; H01L21/48 ; B32B7/02 ; B32B7/04 ; B32B27/06 ; C03C8/18 ; C03C23/00

Abstract:
The deterioration of the resin base materials in the bonded structure is prevented. In a bonded structure containing two base materials at least one of which is a resin, an oxide which contains either P or Ag, V, and Te, and are formed by softening on the two base materials, bond the two base materials. In addition, in a method for producing a bonded structure containing two base materials at least one of which is a resin containing: supplying an oxide containing either P or Ag, V, and Te to the base material; and applying electromagnetic waves to the oxide, whereby the oxide, which soften on the substrates, bond the two base material.
Public/Granted literature
- US20150279700A1 Bonded Structure and Production Method Therefor Public/Granted day:2015-10-01
Information query