Invention Grant
- Patent Title: Intelligent metrology based on module knowledge
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Application No.: US14923607Application Date: 2015-10-27
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Publication No.: US09824940B2Publication Date: 2017-11-21
- Inventor: Shiang-Bau Wang , Victor Y. Lu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01B11/06 ; H01L21/67 ; H01L21/027 ; H01L21/308 ; H01L21/311 ; H01L21/3213 ; H01L21/3065
Abstract:
A method for intelligent inline metrology is a provided. A parameter of a workpiece is measured at a first set of inspection sites on the workpiece. A determination is made as to whether a first specification is met using the measurements at the first set of inspection sites. In response to the first specification being met, the parameter is estimated at a second set of inspection sites on the workpiece. In response to the first specification being unmet, the parameter is measured at the second set of inspection sites and a determination is made as to whether a second specification is met using the measurements at the second set of inspection sites. A system for intelligent inline metrology is also provided.
Public/Granted literature
- US20170092548A1 INTELLIGENT METROLOGY BASED ON MODULE KNOWLEDGE Public/Granted day:2017-03-30
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