Disclosed herein is a light emitting device package strip capable of being used for a display application or an illumination application. The light emitting device package strip may include: a light emitting device package; and an upper adhesive sheet attached onto an upper surface of the light emitting device package so as to support the light emitting device package, wherein the light emitting device package includes: a flip-chip light emitting device having a first electrode pad and a second electrode pad; and a molding member formed to enclose side surfaces and an upper surface of the light emitting device such that the first electrode pad and the second electrode pad are exposed.