Provided is a lead frame including: one or more solder bonding regions containing copper material or copper plating; and a molding resin adhesion region containing a copper oxide film. The solder bonding regions are exposed on a surface of the lead frame. Further, provided is a lead frame manufacturing method including: forming a resist film in a molding resin adhesion region that is included in a surface of a lead frame member made of copper, or that is included in a surface of a copper-plated lead frame member; forming a plating film by performing a metal plating process on one or more solder bonding regions included in the surface of the lead frame member; removing the resist film; and forming a copper oxide film by oxidizing the molding resin adhesion region.