Invention Grant
- Patent Title: Wiring module
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Application No.: US14897141Application Date: 2014-06-02
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Publication No.: US09825272B2Publication Date: 2017-11-21
- Inventor: Masaru Shitamichi , Yoshinao Kobayashi
- Applicant: SUMITOMO WIRING SYSTEMS, LTD.
- Applicant Address: JP Mie
- Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee Address: JP Mie
- Agency: Oliff PLC
- Priority: JP2013-127908 20130618
- International Application: PCT/JP2014/064609 WO 20140602
- International Announcement: WO2014/203713 WO 20141224
- Main IPC: H01M2/20
- IPC: H01M2/20 ; H01M2/10 ; H01M10/48 ; H01G4/38 ; H01G11/10 ; H01G11/76

Abstract:
Provided is a wiring module configured to be attached to a power storage device group in which a plurality of power storage devices are lined up, the wiring module including a voltage detection wire to be connected to at least one of the plurality of power storage devices. An insulation protector is configured with an engagement receiving portion. A detection wire cover covers the voltage detection wire and includes a cover engagement portion that engages with the engagement receiving portion. A cover support portion is formed in the insulation protector, the cover support portion abutting against the detection wire cover from a direction opposite to a disengagement direction in which the engagement portion and the engagement receiving portion disengage from each other, when a force is applied to the detection wire cover in the disengagement direction.
Public/Granted literature
- US20160133907A1 WIRING MODULE Public/Granted day:2016-05-12
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