Invention Grant
- Patent Title: Electronic device mounting board and electronic apparatus
-
Application No.: US14400585Application Date: 2013-05-31
-
Publication No.: US09826641B2Publication Date: 2017-11-21
- Inventor: Akihiko Funahashi , Masatsugu Iiyama , Kanae Horiuchi , Yousuke Moriyama
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto-Shi, Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto-Shi, Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2012-124479 20120531
- International Application: PCT/JP2013/065246 WO 20130531
- International Announcement: WO2013/180288 WO 20131205
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H05K1/18 ; H01L23/04 ; H01L27/146 ; H05K1/02 ; H01L33/48 ; H05K1/03

Abstract:
There are provided an electronic device mounting board and an electronic apparatus that can be made lower in profile. An electronic device mounting board includes an insulating substrate having an opening in which an electronic device is disposed so as to lie over the opening as seen in a transparent plan view, and a reinforcement portion disposed on a surface or in an interior of the insulating substrate so as to lie around the opening of the insulating substrate as seen in a transparent plan view.
Public/Granted literature
- US20150124422A1 ELECTRONIC DEVICE MOUNTING BOARD AND ELECTRONIC APPARATUS Public/Granted day:2015-05-07
Information query
IPC分类: