Invention Grant
- Patent Title: Plasma processing apparatus
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Application No.: US14526900Application Date: 2014-10-29
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Publication No.: US09831064B2Publication Date: 2017-11-28
- Inventor: Hiroo Konno , Takashi Shimomoto
- Applicant: Tokyo Electron Limited , Daihen Corporation
- Applicant Address: JP Tokyo JP Osaka-shi, Osaka
- Assignee: TOKYO ELECTRON LIMITED,DAIHEN CORPORATION
- Current Assignee: TOKYO ELECTRON LIMITED,DAIHEN CORPORATION
- Current Assignee Address: JP Tokyo JP Osaka-shi, Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2013-229382 20131105
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
A plasma processing apparatus can control a ratio between an input power during a pulse-on period and an input power during a pulse-off period by a matching operation of a matching device provided on a high frequency transmission line for supplying the high frequency power as a continuous wave without a power modulation. An impedance sensor 96A provided in a matching device of a plasma generation system includes a RF voltage detector 100; a voltage-detection-signal generating circuit 102; an arithmetic-average-value calculating circuit 104; a weighted-average-value calculating circuit 106; and a moving-average-value calculating unit 108 of a voltage sensor system, and also includes a RF electric current detector 110; an electric current-detection-signal generating circuit 112; an arithmetic-average-value calculating circuit 114; a weighted-average-value calculating circuit 116; a moving-average-value calculating unit 118; and an impedance calculating circuit 120 of an electric current sensor system.
Public/Granted literature
- US20150122420A1 PLASMA PROCESSING APPARATUS Public/Granted day:2015-05-07
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