Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15236472Application Date: 2016-08-14
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Publication No.: US09831093B2Publication Date: 2017-11-28
- Inventor: Kentaro Saito , Hideki Sugiyama , Hiraku Chakihara , Yoshiyuki Kawashima
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2015-164157 20150821
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L21/28 ; H01L29/792 ; H01L29/66 ; H01L27/11573 ; H01L49/02

Abstract:
In a semiconductor device, a memory cell is formed of a control gate electrode and a memory gate electrode adjacent to each other, a gate insulating film formed below the control gate electrode and an insulating film formed below the memory gate electrode and having a charge accumulating part therein. Also, in this semiconductor device, a capacitive element is formed of a lower electrode, an upper electrode and a capacitive insulating film formed between the upper electrode and the lower electrode. A thickness of the lower electrode is smaller than a thickness of the control gate electrode.
Public/Granted literature
- US20170053922A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-02-23
Information query
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