Invention Grant
- Patent Title: Thermal processing apparatus and thermal processing method for heating substrate by light irradiation
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Application No.: US14081013Application Date: 2013-11-15
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Publication No.: US09831108B2Publication Date: 2017-11-28
- Inventor: Kenichi Yokouchi , Nobuhiko Nishide
- Applicant: DAINIPPON SCREEN MFG. CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JP2012-271573 20121212
- Main IPC: H01L21/67
- IPC: H01L21/67

Abstract:
A susceptor that holds a semiconductor wafer placed thereon is capable of moving up and down inside a chamber. For preheating with a halogen lamp, the susceptor moves to a preheating position. The preheating position is a height of the susceptor that achieves the most uniform in-plane illumination distribution of light emitted from the halogen lamp and applied to the semiconductor wafer. After the preheating is finished, the susceptor moves to a flash heating position for irradiation with a flash from a flash lamp. The flash heating position is a height of the susceptor that achieves the most uniform in-plane illumination distribution of a flash emitted from the flash lamp and applied to the semiconductor wafer.
Public/Granted literature
- US20140161429A1 THERMAL PROCESSING APPARATUS AND THERMAL PROCESSING METHOD FOR HEATING SUBSTRATE BY LIGHT IRRADIATION Public/Granted day:2014-06-12
Information query
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