Invention Grant
- Patent Title: High temperature process chamber lid
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Application No.: US14204252Application Date: 2014-03-11
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Publication No.: US09831109B2Publication Date: 2017-11-28
- Inventor: Ilker Durukan , Joel M. Huston , Dien-Yeh Wu , Chien-Teh Kao , Mei Chang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: A62C2/08
- IPC: A62C2/08 ; H01L21/67
Abstract:
Lid assemblies for processing chamber and processing chambers including the lid assemblies are described. The lid assemblies include a high temperature lid module and a housing. The high temperature lid module being positioned adjacent a process liner of a processing chamber. The flexible housing positioned around the high temperature lid module and joined to the high temperature lid module with an elastomeric ring.
Public/Granted literature
- US20140252015A1 High Temperature Process Chamber Lid Public/Granted day:2014-09-11
Information query
