In an embodiment, an electronic component includes a first dielectric layer including an organic component having a decomposition temperature of at least 180° C., a semiconductor die embedded in the first dielectric layer, a second dielectric layer arranged on a first surface of the first dielectric layer, the second dielectric layer including a photo definable polymer composition and defining two or more discrete openings having conductive material, and a first substrate arranged on the second dielectric layer and on the conductive material. One or more contact pads are arranged on an outermost surface of the first substrate.