An electronic component package includes an electronic component, a redistribution layer electrically connected to the electronic component and having terminal connection pads, a passivation layer disposed on one side of the redistribution layer and having openings exposing at least portions of the terminal connection pads, and connection terminals disposed in the openings of the passivation layer and connected to the terminal connection pads. At least one of the openings of the passivation layer has a plurality of protrusion parts.