Invention Grant
- Patent Title: Method of making structure having a gate stack
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Application No.: US14593473Application Date: 2015-01-09
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Publication No.: US09831235B2Publication Date: 2017-11-28
- Inventor: Harry-Hak-Lay Chuang , Ming-Hsiang Song , Kuo-Ji Chen , Ming Zhu , Po-Nien Chen , Bao-Ru Young
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/84 ; H01L27/02 ; H01L29/423 ; H01L29/49 ; H01L29/66 ; H01L29/78 ; H01L29/40 ; H01L29/417 ; H01L29/45 ; H01L29/06

Abstract:
A method includes removing a first portion of a gate layer of a first transistor and leaving a second portion of the gate layer. The first transistor includes a drain region, a source region, and a gate stack, and the gate stack includes a gate dielectric layer, a gate conductive layer over the gate dielectric layer, and the gate layer directly on the gate conductive layer. The method includes removing a gate layer of a second transistor and forming a conductive region at a region previously occupied by the first portion of the gate layer of the first transistor, the unit resistance of the conductive region being less than that of the gate layer of the first transistor.
Public/Granted literature
- US20150118809A1 METHOD OF MAKING STRUCTURE HAVING A GATE STACK Public/Granted day:2015-04-30
Information query
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