Invention Grant
- Patent Title: Semiconductor device including three dimensional memory string
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Application No.: US15045395Application Date: 2016-02-17
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Publication No.: US09831263B2Publication Date: 2017-11-28
- Inventor: Wan Cheul Shin
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2015-0124352 20150902
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/788 ; H01L27/115 ; H01L27/11582 ; H01L29/10 ; H01L23/528 ; H01L23/522

Abstract:
A semiconductor device includes a semiconductor substrate divided into a first area and a second area, the semiconductor substrate including a first dopant of a first type, a first well formed to a first depth in the first area of the semiconductor substrate, the first well including a second dopant of a second type, wherein the second type is different from the first type, a second well including a third dopant of the first type, the second well being surrounded by the first well, and a pipe gate formed on the first area of the semiconductor substrate, the pipe gate being electrically connected to the second well.
Public/Granted literature
- US20170062463A1 SEMICONDUCTOR DEVICE Public/Granted day:2017-03-02
Information query
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