Invention Grant
- Patent Title: Semiconductor optical package and method
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Application No.: US13907280Application Date: 2013-05-31
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Publication No.: US09831357B2Publication Date: 2017-11-28
- Inventor: Yonggang Jin , David Lawson , Colin Campbell , Anandan Ramasamy
- Applicant: STMicroelectronics Pte Ltd. , STMicroelectronics R&D Limited
- Applicant Address: SG Singapore GB Marlow
- Assignee: STMICROELECTRONICS PTE LTD.,STMICROELECTRONICS R&D LIMITED
- Current Assignee: STMICROELECTRONICS PTE LTD.,STMICROELECTRONICS R&D LIMITED
- Current Assignee Address: SG Singapore GB Marlow
- Agency: Seed IP Law Group LLP
- Main IPC: H01L31/0216
- IPC: H01L31/0216 ; H01L31/02 ; H01L31/0203 ; H01L31/0232 ; H01L31/101

Abstract:
Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light protection coating includes one or more openings to allow light to be transmitted to the optical device within the package body. In one embodiment, the light protection coating and the openings allow substantially perpendicular radiation to be directed to the optical device within the package body. In one exemplary embodiment the light protection coating is located on an outer surface of the transparent material. In another embodiment, the light protection coating is located on an inner surface of the transparent material inside of the package body.
Public/Granted literature
- US20140353788A1 SEMICONDUCTOR OPTICAL PACKAGE AND METHOD Public/Granted day:2014-12-04
Information query
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