Invention Grant
- Patent Title: Crimp terminal having a conductor crimping part with an intermediate material with recessed parts and a thin-film layer on its top
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Application No.: US15224756Application Date: 2016-08-01
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Publication No.: US09831567B2Publication Date: 2017-11-28
- Inventor: Daisuke Miyakawa , Koichi Kumai
- Applicant: YAZAKI CORPORATION , Toppan Printing Co., Ltd.
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: YAZAKI CORPORATION,Toppan Printing Co., Ltd.
- Current Assignee: YAZAKI CORPORATION,Toppan Printing Co., Ltd.
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Metrolexis Law Group, PLLC
- Priority: JP2015-153072 20150803
- Main IPC: H01R4/10
- IPC: H01R4/10 ; H01R4/18 ; C23C28/02 ; H01R13/03 ; H01R43/16 ; H01R4/62

Abstract:
In a manufacturing method of an aluminum wire crimp terminal formed by a base material made of a copper-based metal, at the step of forming an intermediate worked material having an unfolded shape of the crimp terminal, fine recessed parts for promoting the adhesive performance of the crimp terminal against a conductor of the wire are formed on a plate-body surface forming an inner face of a conductor crimping part of the intermediate worked material. Subsequently, a thin-film surface layer made of an aluminum-based metal is formed on at least the plate-body surface. Finally, the intermediate worked material is bent to a prescribed terminal shape.
Public/Granted literature
- US20170040713A1 CRIMP TERMINAL AND MANUFACTURING METHOD OF THE SAME, WIRE ASSEMBLY, AND WIRE HARNESS Public/Granted day:2017-02-09
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