Invention Grant
- Patent Title: Low profile connector
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Application No.: US14300855Application Date: 2014-06-10
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Publication No.: US09831573B2Publication Date: 2017-11-28
- Inventor: Emery A. Sanford , Tyson B. Manullang , David G. Havskjold , Tyler S. Bushnell , Eric S. Jol , Anthony S. Montevirgen , John Raff
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agent David K. Cole
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01R12/62 ; H05K1/11 ; H05K1/14 ; H01R13/62 ; H01R12/52

Abstract:
An electrical board-to-board connector including a flexible cable assembly having a low profile or dimensionally reduced configuration. The connector body of a cable assembly may be widened to provide the structural rigidity sufficient to support an array of solder lead connections. Other support elements may be omitted from the cable assembly, which results in a reduced height dimension. The flexible cable assembly may also include a cowling used to retain the cable assembly against a circuit board. The cowling may also be configured to reduce the dimensions or dimensional footprint of the connection.
Public/Granted literature
- US20150357733A1 LOW PROFILE CONNECTOR Public/Granted day:2015-12-10
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