Invention Grant
- Patent Title: Multilayered substrate and method of manufacturing the same
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Application No.: US15196857Application Date: 2016-06-29
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Publication No.: US09832866B2Publication Date: 2017-11-28
- Inventor: Seok-Hwan Ahn , Mi-Sun Hwang , Young-Gwan Ko , Jong-Seok Bae , Myung-Sam Kang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0092257 20150629; KR10-2016-0041222 20160404; KR10-2016-0081510 20160629
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/02 ; H05K3/00 ; H05K3/46 ; H05K1/11 ; H05K3/40 ; H05K3/12
Abstract:
A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern.
Public/Granted literature
- US20160381794A1 MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-12-29
Information query
