Invention Grant
- Patent Title: Method for making conductive pattern and conductive pattern
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Application No.: US14480250Application Date: 2014-09-08
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Publication No.: US09832882B2Publication Date: 2017-11-28
- Inventor: Kwang-Choon Chung , Ji Hoon Yoo , Joonki Seong , Dae Sang Han , Nam-Boo Cho
- Applicant: INKTEC Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: INKTEC CO., LTD.
- Current Assignee: INKTEC CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2013-0107309 20130906
- Main IPC: H05K3/12
- IPC: H05K3/12 ; H05K3/10 ; H05K1/02 ; H05K1/09 ; H05K3/06

Abstract:
Provided herein is a conductive pattern making method and conductive pattern, the method including forming a groove such that its width in an inlet area is bigger than its width in an inner area; filling the groove with a conductive ink composition; and drying the conductive ink composition so that a solvent contained in the conductive ink composition inside the groove is volatilized to reduce the volume of the conductive ink composition.
Public/Granted literature
- US20150068787A1 Method for Making Conductive Pattern and Conductive Pattern Public/Granted day:2015-03-12
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