Invention Grant
- Patent Title: Conductive ball mounting device
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Application No.: US14607070Application Date: 2015-01-27
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Publication No.: US09832884B2Publication Date: 2017-11-28
- Inventor: Chi Won Hwang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2014-0031116 20140317
- Main IPC: H05K3/34
- IPC: H05K3/34 ; B23K3/06 ; H05K1/18 ; H05K3/12

Abstract:
A conductive ball mounting device is provided. The conductive ball mounting device includes: a mask having a thickness equal to or larger than a diameter of a conductive ball and having an opening formed therein, wherein the conductive ball is absorbed and desorbed into and from the opening; a frame having a vacuum hole formed therein and formed to enclose sides and an upper portion of the mask; and a porous member formed between the frame and the upper portion of the mask.
Public/Granted literature
- US20150264818A1 CONDUCTIVE BALL MOUNTING DEVICE Public/Granted day:2015-09-17
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